Printed Circuit Board Assembly

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	Typical applications	Products
	Potting Encapsulation Conformal coating Stencil Surface mount Thermally conductive	One / two component epoxy adhesive Silicone / non-silicone based thermal conductive adhesive UV coating Surface mount adhesive

Model no	Description	Characteristic	Viscosity cPs @25℃	Curing Condition
1102	Hot melt	UL 94V-0 certified, halogen and phosphorus free	Available in rod / particle form	150-160℃ (melting point)
282A/B	Two component epoxy adhesive (Gray)	2W/mK good thermal conductivity, 1:1 mixing ratio, mixpac	Paste	25℃ 24hrs or 65℃ 2hrs
286A/B	Two component epoxy adhesive (White)	2W/mK good thermal conductivity, 1:1 mixing ratio, mixpac	paste	25℃ 24hrs or 65℃ 2hrs
400-58	Surface mount adhesive	Good adhesion, instant curing	200K-250K	120℃ 20mins
500-71	Conformal coating	Low temperature curing	50K-100K	60-70℃ 2hrs
500-71-1	Conformal coating	UV inspection	50K-100K	60-70℃ 2hrs

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