Untitled Document
Building & Construction Materials


Thermal Management Materials


5.Electrically Conductive Interface Pads


Features
  • High thermal and electrical conductivity
  • Low thermal resistance
  • Its unique grain-oriented, plate like structure allows for good conformability to surface
    irregularities, thus maximizing heat transfer


Applications

  • Power conversion equipment
  • Power supplies
  • Large telecommunications switching hardware
  • Notebook computers

 

Emei PN
Colour
Thickness (inch) Thermal Conductivity (W/m-K)
Hardness (Shore 00)
Volume Resistivity (ohm.cm)
Temperature Range(¢J)
Data Sheet(PDF)
E-Fill 9100
Black 0.02 - 0.20 2.0 70 20 -40 ~ 160