Untitled Document
Building & Construction Materials


Thermal Management Materials


2. Phase Change Thermal Interface Materials


Features
  • Proprietary technology prevents excessive pump-out after initial burn-in cycle
  • Naturally tacky and heat sink preheating or additional adhesive for attachment
    are generally not required
  • Low thermal resistance at low pressures
  • It is supplied the in rolls with a top tabbed liner for easy manual or large volume
    automated operations


Applications

  • High frequency microprocessors
  • Notebook and desktop PCs
  • Computer servers
  • Thermal test stands
  • DC/DC Convertors
  • Memory modules
  • Cache chips
  • IGBTs



Emei PN Color
Thermal
Conductivity
(W/m-K)

Phase Change Temperature Range(¢J)
"Burn-in"
Temperature (¢J)

Thermal Impedance @ 10psi/50psi

Temperature Range(¢J)
Data Sheet(PDF)
E-Phase 805
White 0.9 50¢J to 60¢J 75¢J for 5 minutes 0.044/0.025 -40 ~ 160
E-Phase 810
White 2.5 50¢J to 60¢J 75¢J for 5 minutes 0.12/0.079 -40 ~ 160
E-Phase 820
White 2.5 50¢J to 60¢J 75¢J for 5 minutes 0.19/0.088 -40 ~ 160