• Low impurities
• Thermal shock resistance
• Good Out-gassing property *Environmental friendly
• High die-shear strength
• Heat / Moisture resistance
  
  

Application

• COB / High-end (BGA, PPGA) chips potting; Good thermal resistance
• Semiconductor / COB die-attach; Auto dispensing, stamping and screen printing
• Anaerobic IC chips fastening, PCB, LCD product component
• Bonding, Thermal conductive, Sealant, Membrane switches, RFID Antennas, Printed electrodes

Product	Product Name	Color	Hardness	Viscosity (cps)	Cure Schedule	PDF Download
ME-430	COB (Thermal Shock Resistance)	Black	94 D	300K	150 ℃,30mins
EN-7826	One Component Epoxy Adhesive	Black	97 D	95K cps	150 ℃,30mins
EP-937/939	COB	Black	88 D	50k (937)/ 40k (939)	150 ℃,14-16mins
408-14	Epoxy Adhesive	Semi-glossy Black	87 D	100K cps	100 ℃,30mins; 120℃,10mins; 150 ℃,5mins
MD-150	Die Attach (Silver Epoxy)	Silver	-	8k	165 ℃,30mins
DA-5100	Electrical conductive led attach adhesive	Silver	-	Thixotropic paste	150 ℃,30mins
ME-455-1+ME-456 COB (Dam &Fill)	COB (Dam&Fill)	Black	-	7.5K/ 1100K	150 ℃,30mins
MD-120 Die Attach	Die Attach (Silver Epoxy)	Silver	-	13-26K	165 ℃,30mins
MD-200	COB Die Attach (Silver Epoxy)	Silver	87 D	48-94K	95 ℃,40mins
RC-232	Non-conductive Die Attach Adhesive	Green Liquid	-	800-1100	120 ℃,12hrs
K208-10	Conductive Ink	Grey Liquid	-	8K	100 ℃,10mins
C1-1001	Conductive Ink	Silver	-	12K cps	110 ℃,10mins
C1-2001	Conductive Ink	Black	-	Thixotropic paste	110 ℃,10mins
CBF-1001	Conductive Carbon Paste	Black Paste	-	2K	80 ℃,15mins
MD-130	Die Attach Adhesive	Black	88D	60K	100℃,35mins