Thermal Management Materials

2. Phase Change Thermal Interface Materials

Features

• Proprietary technology prevents excessive pump-out after initial burn-in cycle
• Naturally tacky and heat sink preheating or additional adhesive for attachment
• are generally not required
• Low thermal resistance at low pressures
• It is supplied the in rolls with a top tabbed liner for easy manual or large volume automated operations

Applications

• High frequency microprocessors
• Notebook and desktop PCs
• Computer servers
• Thermal test stands
• DC/DC Convertors
• Memory modules
• Cache chips
• IGBTs