Home > Group Products > Thermal Management Materials > Thermal Management Materials
Building & Construction
Materials
 
 

Thermal Management Materials

1. Thermally Conductive Gap Fillers


Features

  • A wide range of thermal, electrical and hardness characteristics
  • UL rating for flame sensitive applications
  • Naturally tacky
  • Available in sheet with a variety of thicknesses
  • Can be die cut into specific dimensions
  • Adhesive coating and fiberglass re-inforcement are optional


Application

  • Cooling components to the chassis or frame
  • High speed mass storage drives
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Automotive engine control units
  • Telecommunication hardware
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)




 
Emei PN Color Thickness
(mm)

Thermal
Conductivity
(W/m-K)

UL
Hardness
(ShoreOO)

Breakdown Voltage
(volt AC)
Temperature Range(℃)
Product Data Download (PDF Format)
E-Fill 8100 Multi-colour 0.01 - 0.20 1.2 94V0 60 >6,000 -40 ~ 200
E-Fill 8200 Light grey 0.01 - 0.20 1.5 94V0 60 >6,000 -40 ~ 200
E-Fill 8300 Blue 0.02 ~ 0.20 1.5 94V0 25 >5,000 -40 ~ 200
E-Fill 8400 Pink 0.02 - 0.20 2.5 94V0 40 >5,000 -40 ~ 200
E-Fill 8500 Violet 0.02 - 0.20 3.0 94V0 40 >6,000 -40 ~ 200
E-Fill 8600 Pink 0.02 - 0.20 3.2 94HB 45 >3,000 -40 ~ 200
E-Fill 8700 White 0.02 - 0.20 3.2 -- 45 >3,000 -40 ~ 200
E-Fill 8800 Yellow 0.01 - 0.20 6.0 94HB 70 >3,000 -40 ~ 200
E-Fill 9400 Grey 0.01 - 0.20 7.0 94V1 50 Non-isolative -40 ~ 200
TCR 200 Multi-colour 0.02 - 0.20 1.2 94V0 40 6000 -40 ~ 200
 
Copyright 2005-2011 Emei (HK) Electronics Ltd. All rights reserved. Terms of Use - Contact Us - Inquiry - Group Products - Site Map