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| About Us |
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Our Factory |
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Quality Certification (ISO, UL Certification) |
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Our New Factory |
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Our Deliverables |
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Our History |
| Group Products |
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Inductive Components |
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Switching Transformer |
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Inverter |
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Telecommunication /ADSL/ LAN Transformer |
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Inductor |
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SMD Power Inductor |
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Laminated Transformer |
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Audio Transformer |
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Current Sense Transformer |
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Custom Made Magnetics (OEM Projects) |
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EMI Shielding Materials |
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Fabric Over Foam Gaskets |
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DYNASHEAR™ Card/Cage Gaskets |
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Conductive Foam |
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Conductive Elastomers |
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Conductive Tapes |
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I/O Shielding Gaskets |
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Environmental / EMI Shielding |
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BeCu Fingerstock |
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BMC Molding Compounds |
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Home Appliances |
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Housewares |
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Electrical Application |
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Automotive |
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Conductive BMC |
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Polymer & Adhesive Material |
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COB / Die Attach / Carbon Ink (COB , Silver Epoxy, Die Attach Adhesive, Conductive Ink) |
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Potting / UV Adhesive (Encapsulating Epoxy, UV/Visible Curable Adhesive, Silicone Rubber) |
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LED Die Attach Adhesive (Silver Epoxy, Epoxy, Silicon Hybrid) |
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Conformal Coating Adhesive, Moisture & Heat Resistance Adhesive
(Thermal Conductive Potting , Silicone, Urethane conformal coating and insulating compound, Moisture Resistance Conformal Coating, Thermal Conductive Epoxy Adhesive, Thermal Conductive Grease, Transparent Silicone) |
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Fixing & General Adhesive
(Electric General Fixing, Epoxy Adhesive, Brush Adhesive, Surface Mount Adhesive, Hot Melt Adhesive, RTV Silicone, Ferrite Adhesive) |
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Instant Adhesive / Others |
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Insulation Material |
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Bisco® & Poron® |
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RIC Poron |
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Insulators (Mylar, Nomex, Formex) |
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Thermal Management Material |
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Thermally Conductive Gap Filler |
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Phase Change Thermal Interface Materials |
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Thermal Grease |
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High Thermally Conductive Insulators |
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Electrically Conductive Interface Pads |
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EMI/Microwave Absorber |
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Building & Construction Materials |
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Aluminum Extrusion |
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Zinc & Aluminum Die Casting |
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Metal Stamping & Forming |
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Plastic Extrusion |
| Product Applications |
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| Inquiry |
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Emei in Asia Pacific |
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Associated Companies of Emei |
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